Bonding diverse thermal expansion materials
US5495978A · kind A · utility
17Cited by
9References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 6, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Sep 6, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure is for a method of bonding materials with severely mismatched coefficients of thermal expansion, such as carbon/carbon and a composite of aluminum oxide and niobium and for the structure of the bonded joint. The key to a good bond between such materials is the use of a thin layer of porous sintered metal as an intermediate material which is bonded to the two diverse thermal expansion materials. The sintered material has a porosity of 20 to 80 percent, and stays bonded to both of the different material surfaces while the sintered material itself is also not destroyed by the thermal stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.