Composition for treating copper and copper alloy surfaces and method for the surface treatment
US5496590A · kind A · utility
19Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Aug 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0591
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.