Assembly formed from conductive paste and insulating paste
US5496619A · kind A · utility
23Cited by
20References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Jun 6, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.