Poly(arylene ether imidazole) surfacing films for flat and parabolic structures

US5496639A · kind A · utility

Assignee

• The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · US

Inventors

• John W. Connell · Newport News, US
• Timothy W. Towell · Hampton, US
• Stephen S. Tompkins · San Jose, US

Key dates

• Filing date: May 4, 1994
• Grant date: Mar 5, 1996
• Expiry date: May 4, 2014

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31721
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

Films of thermoplastic poly(arylene ether imidazole)s (PAEI)s are used as surface modifiers for neat resin panels and composite resin panels. The PAEI polymer contains imidazole groups along the backbone which co-cure, i.e., react chemically, with epoxies or bismaleimides during processing and thereby provide excellent adhesion between the PAEI film and an epoxy or bismaleimide neat resin or composite resin facesheet. The film provides good adhesion and a smooth surface to the finished part and acts as a release agent from the mold. The as-processed integral structures have very smooth (specular) surfaces, and since the film releases readily from a glass mold, no release agent is necessary. The PAEI film is thermally stable, resistant to electron radiation, and adheres tenaciously to the facesheet. The film maintains good adhesion even after thermal cycling from room temperature to .about. -196.degree. C.