Thermoplastic molding materials based on polyamides and carboxyl-containing polyethylene waxes

US5496878A · kind A · utility

Assignee

• BASF SE

Inventors

• Walter Goetz · Ludwigshafen, DE
• Walter Betz · Ludwigshafen, DE

Key dates

• Filing date: Sep 21, 1994
• Grant date: Mar 5, 1996
• Expiry date: Sep 21, 2014

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/01
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials are obtainable by mixing PA1 A) from 0.5 to 5% by weight of a carboxyl-containing polyethylene wax having an average molecular weight M.sub.n (number average value) of from 500 to 20,000 and PA1 B) from 0 to 50% by weight of fibrous or particulate fillers or mixtures in a melt of PA1 C) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g followed by post-condensation in the solid phase.