Patent · US Expired

Polyurethane molding compound and biodegradable filaments manufactured from such molding compound

US5496909A · kind A · utility

10Cited by
3References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 1994
Grant dateMar 5, 1996
Priority date
Expiry dateJun 9, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2913
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

A thermoplastic polyurethane molding compound, which is capable of being spun from the melt into filaments, is able to be enzymatically degraded within a few weeks. The compound contains exclusively linear components, and can be prepared from 100 parts by weight of a polyol combination from 70 to 90 parts by weight of polyester-polyol having a molecular weight of 2000, based on adipic acid with ethane diol, butane diol, hexane diol, neopentyl glycol, or diethylene glycol, and from 10 to 30 parts by weight of polyether polyol based on polyethylene glycol having a molecular weight of 800 to 4000. Also contained are 1,6-hexamethylene diisocyanate or, in its place, isophorone diisocyanate, or dicyclohexylmethane 4,4'-diisocyanate in an equivalency ratio to the entire polyol of the polyol combination of 2.8:1.0 to 12.0:1.0; as well as, as chain lengtheners, 1,4-butane diol and/or 1,6-hexane diol with an equivalency ratio to the entire polyol of the polyol combination of 1.75:1.0 to 11.3:1.0. The NCO coefficient, formulated from the quotients of the equivalency ratios of isocyanate groups multiplied by 100 and of the sum of the hydroxyl groups from the polyols and chain lengtheners, is f…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.