Device for soldering components on plates
US5496988A · kind A · utility
2Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 1994 |
| Grant date | Mar 5, 1996 |
| Priority date | — |
| Expiry date | Dec 27, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device for soldering components on plates under the influence of a gas, having an at least two-piece housing, wherein a seal is provided between the housing elements. It is proposed to employ a liquid as the sealing means. It is achieved by means of this that the mechanical stresses occurring because of thermal stress can be absorbed immediately, because of which the formation of a leak is prevented in a simple manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.