Method of making electrical connections in the manufacture of wiring sheet assemblies
US5497545A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1993 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | Mar 18, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-layer wiring assembly including a stack of insulating layers, e.g. of polyimide, alternating with wiring patterns, typically of copper. To establish the circuit pattern, successive wiring patterns are connected to one another through the intervening insulating layers at predetermined locations, by metal stud connections. The studs are formed during assembly of the stack by wire-bonding a stud onto an underlying wiring pattern through a through-hole of the insulating layer above, and then stamping the exposed end of the wire-bonded stud to spread it into contact with the uppermost wiring pattern. The wire-bonded studs e.g. of Au, form strong bonds with the underlying conductor and are quick to apply in an automated process using a wire-bonding machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.