In-mold labeling using an adhesive
US5498307A · kind A · utility
Inventor
Key dates
| Filing date | Aug 30, 1994 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | Aug 30, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/722
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods have been invented for molding parts and for embedding a decorative, instructional or identifying pattern into the surface of molded products during a molding process. In certain embodiments of this method, the pattern is formed as a pattern structure consisting of one or more shaped film elements or of many complementary shaped elements of various opaque, translucent, and/or transparent films. Inks, paints, overlays and inlays may be used on one or more of the films to further embellish the pattern structure. The pattern structure is then applied to the inner surface of a molding mold. In a rotomolding process according this invention, the mold is charged with casting resin, heated and rotated. The pattern structure is molded into and becomes an integral part of the product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.