Manufacturing process for grooved substrates and multilayer structure
US5498445A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1994 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | Sep 23, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/26
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Grooved substrates and multilayer structures, especially suitable for optical disks, are taught. The major process steps include spin coating of a supporting plate with dissolved material forming a soft layer thereon, stamping grooves into the soft layer to form a structured soft layer showing the negative image of the stamp and hardening the structured soft layer by thermal treatment. The dissolved material contains polymeric organometal compounds comprising polymer siloxane and/or polymer silicates. In one embodiment the structured soft layer is a dielectric layer containing various combinations of the oxides SiO.sub.2, La.sub.2 O.sub.3, PbO and TiO.sub.2. The multilayer structure completed by a magneto-optic layer, a reflector layer and a passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.