Patent · US Expired

Flame-resistant substrate for flexible circuit boards

US5498471A · kind A · utility

9Cited by
5References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 6, 1995
Grant dateMar 12, 1996
Priority date
Expiry dateJun 6, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/268
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A thermostable substrate for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating a substrate of a nonwoven fabric or paper with a flame-resistant, halogen-free polymeric composition. The polymeric composition comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.