Patent · US Expired

Composite diamond abrasive compact

US5498480A · kind A · utility

8Cited by
11References
7Claims
0Family size

Inventors

Key dates

Filing dateMay 5, 1994
Grant dateMar 12, 1996
Priority date
Expiry dateMay 5, 2014

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/30
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A composite diamond abrasive compact comprises a diamond compact bonded to a cemented carbide support along a compact/carbide interface and is characterised by the carbide support comprising at least two zones, a first zone containing a binder metal content of a predetermined amount, and a second zone extending from the interface to the first zone and having a binder metal content which is substantially lower than that of the first zone. The second zone has a depth or thickness of no more than 0,75 mm. The binder metal content of the second zone increases from the interface to the first zone in a continuous, non-interrupted manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.