Composite diamond abrasive compact
US5498480A · kind A · utility
Inventors
Key dates
| Filing date | May 5, 1994 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | May 5, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A composite diamond abrasive compact comprises a diamond compact bonded to a cemented carbide support along a compact/carbide interface and is characterised by the carbide support comprising at least two zones, a first zone containing a binder metal content of a predetermined amount, and a second zone extending from the interface to the first zone and having a binder metal content which is substantially lower than that of the first zone. The second zone has a depth or thickness of no more than 0,75 mm. The binder metal content of the second zone increases from the interface to the first zone in a continuous, non-interrupted manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.