Superconducting device having a single junction structure appropriate for integration
US5498881A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 20, 1994 |
| Grant date | Mar 12, 1996 |
| Priority date | — |
| Expiry date | Sep 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N60/124
Abstract
A superconducting device has a substrate and a superconducting film formed on the substrate. A surface of the substrate has a first surface portion of which a curvature is constant or changes continuously, a second surface portion of which a curvature is constant or changes continuously, and a third surface portion at which the first and second surface portions meet and at which the curvatures of the first and second surface portions become discontinuous. The superconducting film formed on the surface of said substrate has a grain boundary serving as a junction only in a portion corresponding to the third surface portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.