Encapsulating method and products containing encapsulated material
US5500223A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1993 |
| Grant date | Mar 19, 1996 |
| Priority date | — |
| Expiry date | Dec 21, 2013 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61Q17/04
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
An encapsulation process employs an aqueous dispersion of silica having a particle size not substantially greater than 100 nm. An emulsion is formed by high shear mixing of the silica dispersion with the material to be encapsulated and the emulsion is gelled. The process allows hydrophobic materials to be encapsulated in structures which have a high loading of the material and a good degree of imperviousness in the presence of other materials such as surfactants and mineral oils. Using the process, hydrophobic materials such as flavours, fragrances and cosmetic ingredients can be encapsulated for delayed release in a wide variety of products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.