Process for formation for hetero junction structured film utilizing V grooves
US5500389A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1994 |
| Grant date | Mar 19, 1996 |
| Priority date | — |
| Expiry date | Nov 17, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/938
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for formation of a hetero junction structured film utilizing V grooves is disclosed. A monocrystalline film 1 is etched into V grooves, and thereupon, a hetero film 2 having misfits is grown, so that dislocations would be intensively distributed within the V grooves. Then, an oxide layer 3 is formed thereupon, and then, the portions of the oxide layer 3 and the hereto film 2 corresponding to the V grooves are removed by carrying out an etching. Then, the residue oxide layer is removed, thereby forming a non-stress non-dislocation hetero junction structure. Further, the following steps can be added. That is, on the above structure, a thin oxide layer 3 is deposited by carrying out a thermal oxidation or a chemical deposition, and then, a polycrystalline silicon film 4 is deposited. Then the surface irregularities are smoothened by carrying out a selective grinding. Or the following steps may be added. That is, the V groove portions of the hetero film 2 and the monocrystalline film 1 are filled with a monocrystalline film, and the residue oxide layer 3 is removed. Thus a hetero junction film can be grown in which the stress effect is minimized, and the dislocation concentra…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.