Low application temperature hot melt adhesive
US5500472A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1995 |
| Grant date | Mar 19, 1996 |
| Priority date | — |
| Expiry date | Feb 17, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions consisting essentially of: a) 15 to 45% by weight of at least one ethylene n-butyl acrylate copolymer containing 15 to 40% by weight n-butyl acrylate and having a melt index of at least 600; b) 25 to 55% of a terpene phenolic tackifying resin or a hydrogenated derivative thereof, the resin having a Ring and Ball softening point less than 125.degree. C.; c) 15 to 40% by weight of a low melting point synthetic Fischer-Tropsch wax; and d) 0 to 1.5% stabilizer. The adhesives are characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.