Printed circuit board EMI shielding apparatus and associated methods
US5500789A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1994 |
| Grant date | Mar 19, 1996 |
| Priority date | — |
| Expiry date | Dec 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Transverse electromagnetic mode (TEM) radiation emitted from a side edge portion of a circuit board substrate portion during operation of the circuit board is intercepted by a specially designed shield structure carried by the substrate side edge portion, and the intercepted radiation is conductively returned to the substrate ground plane, through a relatively short grounding path, for return to the emitting source(s). In one form thereof, the shield is a copper plating material extending along and covering the substrate side edge portion and adjacent peripheral portions of the opposite sides of the substrate. In another form thereof, the shield is a snap-on metal shield structure that is removably mounted around the substrate side edge portion. The shield may be electrically coupled to the substrate ground plane by directly contacting a ground plane edge portion with the copper plating, using a filter structure to couple the shield to the ground plane, or otherwise using an external grounding path. When the shield is formed by using a copper plating, the shield may also be used as a grounding connection by sliding it into a metal chassis support rail structure. The grounding conne…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.