Method for connection of signals to an integrated circuit
US5501006A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 1994 |
| Grant date | Mar 26, 1996 |
| Priority date | — |
| Expiry date | May 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for connecting signal leads to an integrated circuit transmits a distribution signal on a lead. A substrate is provided with leads interconnecting a number of bonding pads. The integrated circuit has a corresponding number of bonding pads. An insulation layer is interposed between the integrated circuit and the substrate except for the bonding pads. The distribution lead is connected to the bonding pads on the substrate. The bonding pads of the substrate and the bonding pads of integrated circuit are interconnected. With this approach, signals may be distributed radially from a central point to equidistant circuits instead of sequentially or serially through a number of circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.