Process for producing microstructure metallic elements

US5501784A · kind A · utility

Assignee

• MicroParts GmbH · DE

Inventors

• Christoph Lessmo/ llmann · Gernsbach, DE
• Joachim Eicher · Karlsruhe, DE
• Holger Reinecke · Emmendingen, DE

Key dates

• Filing date: Mar 10, 1994
• Grant date: Mar 26, 1996
• Expiry date: Mar 10, 2014

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29K2883/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microstructured mold with at least one open cavity is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The cavity is filled and the mold covered by a flowable material and the solidified flowable material is separated from the mold giving a microstructure element. Alternatively, the top portion of the solidified flowable material is removed to expose the surface of the mold and the solidified material filling the cavity. A layer of conductive material is applied to the exposed surface and remaining solidified material. Then the conductive layer and the remaining solidified material are separated from the mold to provide a structure with a shape complementary to the mold. A layer of metal is electrodeposited on the complementary structure and, finally, the metal layer is separated to produce a metallic microstructure element. The microstructure elements produced by the process have good material properties and can be prepared in a broad range of shapes and structures.