Ablative imaging by proximity lithography
US5501944A · kind A · utility
19Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1995 |
| Grant date | Mar 26, 1996 |
| Priority date | — |
| Expiry date | Jan 31, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention includes a method of creating a shaped image in a workpiece using a high energy source, with the method comprising positioning a layer proximate the workpiece such that the layer prevents debris from the workpiece from dispersing, and directing radiation from the high energy source through the layer to the workpiece, the layer substantially transparent to radiation emitted by the high energy source such that the high energy source is capable of forming the shaped image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.