Patent · US Expired

Toughened partly aromatic copolyamides

US5504146A · kind A · utility

7Cited by

3References

8Claims

0Family size

Assignee

BASF SE

Inventors

Walter Goetz · Ludwigshafen, DE
Christoph Plachetta · Schifferstadt, DE
Uwe Wolf · Magdala, DE
Gerd Blinne · Worms, DE
Horst Reimann · Worms, DE

Key dates

Filing date	Jul 26, 1994
Grant date	Apr 2, 1996
Priority date	—
Expiry date	Jul 26, 2014

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA1 A) 40-95% by weight of a partly aromatic copolyamide having a triamine content of less than 0.5% by weight, consisting essentially of PA2 A.sub.1) 20-90% by weight of units derived from terephthalic acid and hexamethylenediamine, PA2 A.sub.2 5-50% by weight of units derived from .epsilon.-caprolactam and PA2 A.sub.3) 0-80% by weight of units derived from adipic acid and hexamethylenediamine, and PA1 B) 5-60% by weight of fibrous or particulate fillers or mixtures of these.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.