Unitary heat sink for integrated circuits
US5504652A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1994 |
| Grant date | Apr 2, 1996 |
| Priority date | — |
| Expiry date | Sep 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A unitary heat sink including a planar contact portion for contacting the top of an IC. The heat sink is constructed from a material having a thermal conductivity of at least 150 watts per meter Degree Kelvin (W/m.degree.K.) but preferably is constructed from aluminum having a conductivity of 221 (W/m.degree.K.). A number of leg portions extend from the contact portion such that each leg portion has a distal end. The leg portions, being made of the same material as the contact portion, are configured to have a sufficient resiliency such that deformations of the leg portions provide a spring force in the range of 5 to 16 lbs against the top of the IC. A method for dissipating heat from an integrated circuit includes the steps of forming a unitary heat sink from a heat sink material, where the heat sink includes a contact portion and a number of integral, spring leg portions. The method continues with the attachment of an integrated circuit to a printed circuit board, and the attachment of the leg portions of the heat sink to the printed circuit board such that the contact portion of the heat sink is urged towards the heat transfer surface of the integrated circuit with a spring forc…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.