Heat sinking assembly for electrical components
US5504653A · kind A · utility
19Cited by
16References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1994 |
| Grant date | Apr 2, 1996 |
| Priority date | — |
| Expiry date | Nov 21, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sinking assembly for dissipating thermal energy from heat generating electrical components wherein the heat sinking assembly includes a component support member and a housing which surrounds and clamps the electrical components to the heat sink wherein the components are not heat sunk until the first half of the housing assembly is attached to the circuit board or to the second half of the housing assembly. The clamping force for the electrical components may also be varied for optimum heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.