Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
US5504993A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1994 |
| Grant date | Apr 9, 1996 |
| Priority date | — |
| Expiry date | Aug 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a printed circuit board power core is disclosed wherein ceramic particles that have a diameter that is approximately equal to the desired dielectric thickness are combined with dielectric powders that have a relatively very small size. To produce a dielectric core using this technique, a dielectric material mixture is applied between two conductor layers and bonded therebetween. This dielectric material mixture preferably has a concentration of large particles equal to the desired core thickness with a loading factor of large/small particles less than the maximum ratio needed to provide the desired dielectric constant, but greater than the ratio required to provide stability during the pressing and curing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.