Patent · US Expired

Insulative wafers for interconnecting a vertical receptacle to a printed circuit board

US5507653A · kind A · utility

80Cited by
5References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 12, 1995
Grant dateApr 16, 1996
Priority date
Expiry dateApr 12, 2015

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R12/7082
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

This invention relates to a connector wafer for interconnecting a vertical receptacle and a printed circuit board and a connector assembly for interconnecting parallel circuit boards. The connector wafer has an insulative block, locating pins providing for an interference fit into the printed circuit board, an attachment fork for receiving a locating pin on the vertical receptacle, passages for receiving terminal tails of the female receptacle, and standoffs providing a space between a side of the connector connector wafer and an opposing mating side of the vertical female receptacle. The connector assembly is an assembly of the connector wafer and the vertical receptacle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.