Emulsifying epoxy resin composition and curable composition
US5508326A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 10, 1994 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Nov 10, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An emulsifying epoxy resin composition having excellent emulsifiability and storage stability, which comprises a specific epoxy resin (I), an emulsifiable epoxy compound (II) prepared by reacting an urethane compound (II-1), prepared by the reaction of a polyalkylene polyether polyol compound (II-1-1) having a number average molecular weight of 200 to 12,000 and an ethylene oxide content of 80% by weight or above with an excess amount of a polyisocyanate compound (II-1-2), with a specific epoxy compound (II-2) and an alkylphenol ethoxylate (II-3) having a number average molecular weight of 300 to 5,000 at a specific ratio, and water (III). A curable composition having a high cure rate and the cured product obtained there from having excellent film strength, water resistance and so on, which comprises the above-described emulsifiable epoxy resin composition and an active organic amino compound (IV) is also within the scope of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.