Moisture-curable hot melt silicone pressure-sensitive adhesives
US5508360A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1995 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Mar 31, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a silicone pressure-sensitive adhesive composition which cure upon exposure to ambient moisture. The moisture-curable silicone pressure-sensitive adhesive composition of the instant invention comprise: (A) an organopolysiloxane resin containing curing radicals of the formula --SiY.sub.2 ZNY'ZSiR.sup.1.sub.x Y".sub.3-x wherein R.sup.1 is a monovalent hydrocarbon radical, each Z is a divalent linking group, each Y is independently selected from the group consisting of a monovalent organic radical, an enoloxy radical, an alkoxy radical, and an oximo radical; Y' is selected from the group consisting of a monovalent organic radical, a hydrogen atom, and --ZSiR.sup.1.sub.x Y".sub.3-x ; Y" is selected from the group consisting of an enoloxy radical, an alkoxy radical, and an oximo radical; and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radicals selected from the group consisting of hydroxyl radicals, alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, enoloxy radicals, aminoxy radicals, acetamido radicals, N-methylacetamido …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.