Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package
US5508565A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1994 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Dec 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the first chip, and a plurality of second terminals formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members connected to the first terminals and the second terminals and provided for external connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.