Ultrathin magnetoresistive sensor package
US5508611A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1994 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Apr 25, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A magnetic field sensor assembly comprising a flexible circuit board having a major surface with a predetermined area for receiving at least one semiconductor magnetic field sensor chip, the chip is affixed to the predetermined area of the flexible circuit board in relationship to a predetermined reference location, which reference location can be used in encapsulation and/or use of the magnetic field sensor chip. Several magnetic field sensor chips can be readily, closely disposed on the flexible circuit board in predetermined known locations. The circuit board can conform to any desired predetermined shape. The shape can be determined by a circuit's conformation on a supporting magnet body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.