System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind
US5508884A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Apr 16, 1996 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind. The system for dissipating heat of the invention is of the type comprising a sealed metal enclosure (21) the interior volume of which contains a fluid (22), said component (11) being fixed to the outside wall of said enclosure (21) and connected to a heat dissipator (12) by said enclosure (21) and is characterized in that the phase change temperature of the fluid (22) at atmospheric pressure is less than a given maximum ambient temperature and in that said enclosure (21) also contains a volume of gas (23) different from the fluid (22) so that variation in the ambient temperature causes a variation in the pressure inside the enclosure (21) which modifies the phase change temperature of the fluid (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.