Heat-resisting plate having a cooling structure and method of manufacturing it
US5509472A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1992 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Nov 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E30/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat-resisting plate employed in various devices that handle high temperature plasma or high energy particles, including a metallic substrate having a cooling structure wherein cooling pipes are embedded against the substrate by a thermal spray layer of the same material as the metallic substrate on one or both faces of the metallic substrate. In forming the heat-resisting plate, the metallic substrate is processed to the form of a plate, cooling pipes are arranged on one or both faces of this metallic substrate, and the cooling pipes are fixed by spraying a thermal spray layer on the face or faces of the metallic substrate where the cooling pipes are arranged, thereby to embed the cooling pipes between the thermal spray layer and the metallic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.