Polishing apparatus
US5509850A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Jun 24, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus has a polishing head for polishing an object such as a semiconductor wafer by using a polishing tape stretched between two guide rollers. The head can be rotated so as to change the angle of contact between the tape and the object and also undergo a reciprocating motion perpendicular to the direction of supply of the tape. For this purpose, the apparatus includes a first plate attached to the head and a second plate supported parallel to each other and in motion-communicating relationship by means of rods which are attached to the first plate and penetrate the second plate. The second plate is attached to the rotary shaft of a direct drive motor for causing oscillatory angular motion. This rotary shaft is tubular and an inner shaft for causing the oscillatory motion passes slidably therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.