Patent · US Expired

Process for assembly and bonding of electronic components on an insulating support

US5510139A · kind A · utility

8Cited by

6References

6Claims

0Family size

Assignee

AMEG Additive Metallisierung-Entwicklunge-und Anwendungssesellshaft GmbH · DE

Inventors

Erich Deissner · Schwelm, DE
Jonathan D. H. Hammond · Solingen, DE
Dieter Meier · Bad Nenndorf, DE

Key dates

Filing date	Oct 14, 1993
Grant date	Apr 23, 1996
Priority date	—
Expiry date	Oct 14, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1092
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

In a process for assembly and bonding of electric and/or electronic components (3), provided with metal connections (11), on an insulating support (1) to be provided with strip conductors, it is provided, to increase the economic efficiency, that a catalyst (7) for currentless metal deposition is applied on support (1) first in the area of the strip conductor structure, that components (2) are positioned with their metal connections (11) on the assigned strip conductor points of support (1) and that then, by currentless metal deposition from a chemical metallization bath, bonding (13, 14) of metal connections (11) is performed simultaneously with the formation of metallic strip conductors (5).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.