Thermally conductive materials containing titanium diboride filler
US5510174A · kind A · utility
54Cited by
13References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Apr 12, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2754
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Titanium diboride (TiB.sub.2) is used as a thermally conductive, filler in thermally conductive materials. The TiB.sub.2 provides improved thermal conductivity in comparison to conventional thermally conductive, electrically insulative or thermally conductive electrically conductive fillers especially at low application pressures. The materials into which the TiB.sub.2 filler is incorporated includes elastomers, films and tapes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.