Radiation-curable release compositions

US5510190A · kind A · utility

Assignee

• Avery Dennison Corporation · US

Inventors

• John K. Allen · Batavia, US
• Qun Yu · Beijing, CN

Key dates

• Filing date: Feb 27, 1995
• Grant date: Apr 23, 1996
• Expiry date: Feb 27, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31663
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A radiation-curable release composition is disclosed which comprises: PA1 (A) an organopolysiloxane represented by the formula EQU RSi(CH.sub.3).sub.2 --O--(Si(CH.sub.3).sub.2 O).sub.n (Si(CH.sub.3)(R)O).sub.m Si(CH.sub.3).sub.2 R (I) wherein in Formula (I), each R is --R.sup.1 --O(O)C--C(R.sup.2).dbd.CH.sub.2, --R.sup.1 --O--C(R.sup.2).dbd.CH.sub.2 or ##STR1## R.sup.1 is a hydrocarbylene group; each R.sup.2 is independently hydrogen or a methyl or ethyl group; m is a number from about 1 to about 15; and n is a number from about 50 to about 300; and PA1 (B) an organosiloxane polymer represented by the formula EQU (R.sub.3 SiO)(Si(CH.sub.3).sub.2 O).sub.n (SiR.sub.3) wherein in Formula (II), each R is independently a hydrocarbon group and n is a number in the range of about 1000 to about 20,000. A method of producing release-coated substrates, the release-coated articles thus produced, and multi-layer articles or constructions incorporating a release layer also are disclosed. When the release compositions are cured such as by radiation, the cured compositions exhibit a desirable high and controlled release force at high speeds such as the speeds utilized in label processing.