Selective metallization process
US5510216A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1995 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Aug 29, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.