Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
US5510758A · kind A · utility
179Cited by
5References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1994 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Apr 6, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate, a dielectric film extending on the ground conductor, and a metal wiring line extending on the dielectric film. A semiconductor chip is connected to the microstrip wiring board via a bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.