Paste for resistive element film
US5510823A · kind A · utility
6Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1992 |
| Grant date | Apr 23, 1996 |
| Priority date | — |
| Expiry date | Feb 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/06513
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A resistive element film-forming paste includes (1) an organic metal compound, (2) at least one organic non-metal additive, and (3) a solution of asphalt in a solvent. A resistive element is formed by coating the paste on a substrate followed by calcining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.