Method for making integrated matching layer for ultrasonic transducers
US5511296A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Apr 8, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method of forming an impedance matching layer of an acoustic transducer includes geometrically patterning impedance matching material directly onto a radiating surface of piezoelectric substrate. In one embodiment, the matching layer is deposited onto the piezoelectric substrate and photolithographic techniques are utilized to pattern the matching layer to provide posts tailored to better match the piezoelectric substrate to a medium into which acoustic waves are to be transmitted. A nominal layer of metal between the posts and the piezoelectric substrate improves the attachment of the matching material to the substrate. The nominal layer may be chrome-gold and the matching material may be copper. Typically, the radiating surface is the substrate front surface from which acoustic waves are directed into a medium of interest, e.g., water or human tissue. However, the radiating surface may be the substitute rear surface, with the patterned matching layer providing acoustic matching to a backing layer for absorbing acoustic energy. In another embodiment, matching layers of different acoustic impedances are deposited and patterned on both the front and rear surfaces to provide matchi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.