Hot-melt adhesive that has good open time at room temperature and can form creep-resistant bonds
US5512124A · kind A · utility
7Cited by
26References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Jan 14, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot-melt adhesive of ethylene/vinyl acetate copolymer and tackifying resin can be spread into a thin layer that remains tacky for more than 5 seconds, after which a bond can be made without applying heat or more than hand pressure. Within a short period of time, the adhesive crystallizes so that the bond becomes creep-resistant. The temperature at which this hot-melt adhesive can be spread into thin layers is significantly lower than could be used with prior hot-melt adhesives that develop creep resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.