Epoxy resin composition and applications, in particular in composite structures, using imidazole/polyamine mixture
US5512372A · kind A · utility
16Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Aug 24, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Hardenable or polymerizable epoxy resin-based composition, characterized in that its hardener system comprises a combination in synergic quantities of: (i) at least one imidazole which, alone, can cause the polymerization of the epoxy resin only at a temperature above about 75.degree. C., (ii) at least one polyamine compound which, alone, leads to the polymerization of the epoxy resin at a temperature lower than about 75.degree. C. Such a resin is particularly suitable for the manufacture of composite structures, applicable in particular in ship- or boatbuilding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.