Dissipation of heat through keyboard using a heat pipe
US5513070A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1994 |
| Grant date | Apr 30, 1996 |
| Priority date | — |
| Expiry date | Dec 16, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved heat dissipation device particularly suited for removing heat from a surface mounted integrated circuit component coupled to a printed circuit board in a portable computer. Vias, which are at least partially filled with a heat conductive material, improve heat transfer between a component and a heat conductive block mounted on opposite surfaces of the circuit board. A first section near one end of the heat pipe is attached to the heat conductive block in a channel formed receptive to the heat pipe. A second section of the heat pipe including the second end is attached to a metal plate which is affixed beneath the keyboard. Heat from the component flows through the vias to the block and is transferred by the heat pipe to the metal plate where it is dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.