Electroplating bath for the electrodeposition of silver-tin alloys
US5514261A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1995 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Jan 30, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/64
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.