Solvent-less vapor deposition apparatus and process for application of soldering fluxes
US5514414A · kind A · utility
9Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1994 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Nov 21, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.