Method and apparatus for improving the performance of light emitting diodes
US5514627A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1994 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Jan 24, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/938
Abstract
A method for increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature is disclosed. During the manufacture of the light emitting diode, a liquid coating is applied to the light emitting die after the die has been placed in its lead frame. After the liquid coating has been placed on the die and its lead frames, a thermosetting encapsulant material is placed over the coating. The operation that cures the thermosetting material leaves the coating liquid intact. As the die and the encapsulant expand and contract at different rates with respect to changes in temperature, and as in known light emitting diodes the encapsulating material adheres to the die and lead frames, this liquid coating reduces the stresses that these different rates of expansion and contraction normally cause by eliminating the adherence of the encapsulating material to the die and frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.