Radiation-curable acrylate/silicone pressure-sensitive adhesive compositions
US5514730A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1994 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Jul 25, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/931
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a radiation curable vinyl-silicone pressure-sensitive adhesive composition which combines the advantages of silicone and acrylate pressure-sensitive adhesives and which does not experience gross phase separation problems. The composition comprises at least about 20 weight percent of a certain telechelic silicone polymer, about 0.5 to about 80 weight percent of monofunctional free-radically polymerizable vinyl monomer copolymerizable with the silicone polymer, and a sufficient amount of a silicate MQ tackifying resin to impart a degree of adhesive tack to the cured composition at the use temperature, wherein the weight percentages of the silicone polymer and the monomer are based upon the total weight of the silicone polymer and monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.