Circuit structure with non-migrating silver contacts
US5514838A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1994 |
| Grant date | May 7, 1996 |
| Priority date | — |
| Expiry date | Sep 27, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1423
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly that prevents silver migration by providing conductive rims around oxidizable silver contacts that contact a substrate. Typically the silver contacts are supported by respective metal pads on the substrate with a contact potential existing at each contact-pad junction. In many applications an electrical circuit transmits electrical signals via the contacts to produce potential differences between the contacts and create electrical fields at their surfaces. The conductive rims have a work function that is sufficiently small to reduce the electric fields and contact potentials so as to inhibit the ionization of the oxidized contacts' surfaces and prevent silver migration across the metal pads and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.