Apparatus and process for soldering component onto boards

US5515605A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Horst Hartmann · Dresden, DE
• Peter Saile · Stuttgart, DE

Key dates

• Filing date: Jan 19, 1995
• Grant date: May 14, 1996
• Expiry date: Jan 19, 2015

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49144
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A device or oven and a method for soldering components (34, 36) onto boards (18), with the device having at least a preheating zone (10) and a soldering zone (12), and a transport device (16), by means of which the boards (18) can be moved from one zone (10) to the next. Infrared radiators (22) extending in the transport direction (20) are disposed in the preheating zone (10) and infrared radiators (24) extending transversely to the transport direction (20) are disposed in the soldering zone (12), with the radiators radiating essentially diagonally, i.e., obliquely, the board surface. As a result, it is achieved that less radiation is absorbed on the surface of the board, or the top surfaces of the components (34, 36), than on the side walls of the corresponding components (34, 38). Moreover, according to a further feature of the invention soldering ovens are adjusted using sensors (54, 56) disposed on measuring boards (18') and in the oven (10, 12).