Pellet bonding apparatus
US5516026A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1994 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | Oct 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pellet bonding apparatus is disclosed, which comprises a wafer stage, a pellet removal/transfer mechanism, a pellet position correcting mechanism, and a bonding mechanism. In the wafer stage, the wafer ring unit can be rotated through an angle corresponding to each of a plurality of areas, into which a pellet group of a wafer ring unit provided on the wafer stage can be divided. The pellet position correcting mechanism rotates a rotary table through a predetermined angle irrespective of whether the wafer ring unit has been rotated or not, whereby pellet position correction is made such that the pellet has the same orientation at all times when being removed by the bonding mechanism. A sheet expander can set the wafer ring unit on the wafer stage. It has an expander ring with an end formed with air stream outlet ports. When a sheet of the wafer ring unit is supported on the end of the expander ring and expanded by lowering a wafer ring of the wafer ring unit with a press ring, an air layer is formed between the sheet and the expander ring end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.