Soldering method and apparatus for use in connecting electronic circuit devices
US5516031A · kind A · utility
20Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 1994 |
| Grant date | May 14, 1996 |
| Priority date | — |
| Expiry date | May 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.